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Almit Solder paste, SJM-03W GT(R)-S, 20-38 µm, Can 500 g

801085
€97.25 *
Content: 0.5 Kilogramm (€194.50 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

  • Currently not in stock.
    Delivery time expected 5 days.
    • 811147
    • ALM83190099
    • 4050075140985
    • Almit
    • 831 900 99
    • Stück
    • 1
    Perfect performance in the SMT process! You think soldering defects in the SMT process cannot be... more

    Perfect performance in the SMT process!
    You think soldering defects in the SMT process cannot be avoided? No, that's not true! Discover the GT-R and NH-IMT solder pastes. They guarantee optimal wetting on a wide variety of surface materials and minimize solder defects.

    The No clean solder paste of the GT series has a higher solder joint
    strength than standard SAC or TSC alloys. Almit GT Series solder paste has, among other things, very good cohesive properties, making it very suitable for pin-in-paste applications. The solder retracts exceptionally well along the terminal legs into the vias.



    Flussmittelanteil: 12 %
    Korngröße: 20-38 µm
    Inhalt: Dose 500 g
    Schmelzbereich: 210-225 °C
    Legierung: Sn-0,3Ag-0,7Cu-2,0Bi-0,01Fe
    Flussmittel: GT R
    Weiterführende Links:
    hohe Vorheiztemperatur, perfektes Druckbild optimale Benetzung sehr großer Anwendungsbereich... more
    • hohe Vorheiztemperatur, perfektes Druckbild
    • optimale Benetzung
    • sehr großer Anwendungsbereich
    • für PIP/THR designed
    • sehr guter Druck auf kleinsten Strukturen
    • RoHS-konform
    • geeignet unter anderem für Kupfer, Nickel, Messing, Phosphor Bronze
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