Almit Solder paste, SJM-03W GT(R)-S, 20-38 µm, Can...

€97.25 *

Content: 0.5 Kilogramm (€194.50 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

Availability: Currently not in stock.
Delivery time expected 5 days.

Catalogue no.: 811147
Article no.: ALM83190099
EAN: 4050075140985
Manufacturer: Almit
Man.-art.-no.: 831 900 99
Sales unit: Stück
Packaging unit: 1

Perfect performance in the SMT process! You think soldering defects in the SMT process cannot be... more

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Perfect performance in the SMT process!
You think soldering defects in the SMT process cannot be avoided? No, that's not true! Discover the GT-R and NH-IMT solder pastes. They guarantee optimal wetting on a wide variety of surface materials and minimize solder defects.

The No clean solder paste of the GT series has a higher solder joint
strength than standard SAC or TSC alloys. Almit GT Series solder paste has, among other things, very good cohesive properties, making it very suitable for pin-in-paste applications. The solder retracts exceptionally well along the terminal legs into the vias.

Flussmittelanteil:	12 %
Korngröße:	20-38 µm
Inhalt:	Dose 500 g
Schmelzbereich:	210-225 °C
Legierung:	Sn-0,3Ag-0,7Cu-2,0Bi-0,01Fe
Flussmittel:	GT R

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hohe Vorheiztemperatur, perfektes Druckbild optimale Benetzung sehr großer Anwendungsbereich... more

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hohe Vorheiztemperatur, perfektes Druckbild
optimale Benetzung
sehr großer Anwendungsbereich
für PIP/THR designed
sehr guter Druck auf kleinsten Strukturen
RoHS-konform
geeignet unter anderem für Kupfer, Nickel, Messing, Phosphor Bronze