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Article successfully added.

Almit Solder paste lead-free, LFM 48W SUC UI, 20-38 µm, Can 500 g

Almit
801305
From €113.38 *
Content: 0.5 Kilogramm (€226.76 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

  • Availability: Currently not in stock.
    Delivery time expected 43 days.

    Inhalt

    Dose 500 g

    Korngröße

    • Catalogue no.: 801305
    • Article no.: ALM81150099
    • EAN: 4050075563371
    • Manufacturer: Almit
    • Man.-art.-no.: 81150099
    • Sales unit: Stück
    • Packaging unit: 1
    Description Features
    Description
    The paste makes it possible to switch from soldering under nitrogen to nitrogen-free soldering. more
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    The paste makes it possible to switch from soldering under nitrogen to nitrogen-free soldering.

    Schmelzbereich: 217-220 °C
    Flussmittel: SUC-UI
    Flussmittelanteil: 11,5 %
    Weiterführende Links:
    Features
    O²-Reflow, wenig Lunker und hohe Vorheiztemperatur gleichbleibende Pastenmenge und... more
    Zurück
    • O²-Reflow, wenig Lunker und hohe Vorheiztemperatur
    • gleichbleibende Pastenmenge und Druckqualität
    • gute Benetzung auch unter normaler O²-Atmosphäre
    • formstabil auf allen Teilen
    • Stickstoff wird nicht benötigt, wodurch laufende Kosten gesenkt werden können
    • Reduzierung des Energieverbrauchs trägt zur Verringerung der CO²-Produktion bei
    • gute Benetzung auf Nickeloberflächen
    • kann BGA Benetzungsprobleme und ''Head-In-Pillow'' Defekte beseitigen
    • hohe Zuverlässigkeit durch "No Clean"- Flussmittel
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