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Solder Chemistry Solder Paste No Clean, BLF-02, 15-30 µm, Dose, 200 g

Preview: SUD-SC-BLF02-89-200 Preview: SUD-SC-BLF02-89-200
SUD-SC-BLF02-89-200
SUD-SC-BLF02-89-200
   
From €74.43 *
Content: 0.2 Kilogramm (€372.15 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

  • Availability: Currently not in stock.
    Delivery time expected 7 days.

    Typ

    Dose

    Inhalt

    Körnung

    15-30 µm
    • Catalogue no.: 810199
    • Article no.: SUD1102141101
    • EAN: 4050075091430
    • Manufacturer: Solder Chemistry
    • Man.-art.-no.: 1102141101
    • Sales unit: Stück
    • Packaging unit: 1
    Description Features
    Description
    BLF 02 solder paste is a sophisticated high-tech product suitable for all lead-free SMT... more
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    BLF 02 solder paste is a sophisticated high-tech product suitable for all lead-free SMT applications. Its development is based not only on the latest findings in solder chemistry, many years of experience in the SMT field, long-term cooperation with users of vapor phase soldering equipment included, but also the careful and strict observance of the
    guidelines of ISO, EN, IPC and MIL standards.

    Flussmittelanteil: 11 %
    Metallgehalt: 89 %
    Legierung: Sn96,5Ag3,0Cu0,5
    Schmelzpunkt: 217 °C
    Gewicht: 220 g
    Weiterführende Links:
    Available downloads:
    Features
    Typ RE-L1 hervorragende Konturenstabilität keine Lotkugel- oder Spritzerbildung langzeitige... more
    Zurück
    • Typ RE-L1
    • hervorragende Konturenstabilität
    • keine Lotkugel- oder Spritzerbildung
    • langzeitige Verarbeitbarkeit und lange Standzeit
    • hohe Temperaturstabilität
    • feststoffarme Paste mit nur 4,6 % Rückstand
    • die Rückstände entsprechen der RE-L0 Klassifizierung
    • enthält Korrosionsinhibitoren
    • hervorragende Druckqualität
    • hinterlässt keine teerartigen Rückstände in der Lötanlage
    • lötet problemlos auch auf leicht korrodierten Oberflächen
    • eine Lagerung im Kühlschrank ist nicht notwendig
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