Emil Otto Underside cleaner Etimol SUC 61 RAN, 5 l

The water-based, pH-neutral cleaning medium efficiently removes residues of lead-containing, lead-free or so-called No Clean solder pastes as well as SMT adhesives from the underside of the stencil.

After the printing process, Etimol SUC 61 RAN optimally wets both the cleaning roller or cleaning fleece and the stencil side, so that
consistently high and qualitatively reproducible cleaning results are achieved. The innovative homogeneous formulation and the optimum drying behavior minimize the phenomena of streaking and smearing of solder paste components often observed with commercially available water-based cleaners.

Depending on the printer model and manufacturer, the
cleaning medium is either filled directly into the supply tank of the stencil printer undiluted or aspirated directly from the delivery container at room temperature.